Multi-Layer

Multilayer PCBs are circuit boards with four or more layers, separated by insulating dielectric layers and connected by conductive vias. This construction allows for higher circuit density, improved electromagnetic shielding, and reduced signal interference. They are used in demanding applications such as telecommunications, automotive, and medical technology, where reliable and compact electronic solutions are required. By combining multiple signal, power, and ground layers, multilayer PCBs provide high performance and design flexibility for modern electronic systems.

Feature Specification
Layer 4 to 40+ layers
Board Thickness 0.5 mm to 4.0 mm
Copper Foil 12–105 µm (standard: 18 or 35 µm)
Treatment ENIG, OSP, HASL, Immersion Silver/Tin
Solder Mask Green, Blue, Black, White

Applications

  • Medical Technology

    Multi-layer PCBs enable compact and powerful medical devices like imaging systems, diagnostic equipment, and implants. They provide high signal integrity and reliability for precise measurements and controls.

  • Aerospace

    In demanding environments like aerospace, multi-layer PCBs provide stability, high density, and reliable performance. They withstand extreme temperatures and vibrations, ensuring secure communication and navigation.

  • Automotive Industry

    Vehicles with modern assistance systems, electric motors, and infotainment solutions require powerful electronics. Multi-layer PCBs enable compact designs and optimize signal processing for greater safety and efficiency.

  • Telecommunications & Network Technology

    Whether for high-speed data transmission or 5G technology, multi-layer PCBs ensure stable connections, minimize signal loss, and enable powerful network solutions with high bandwidth.

  • Industrial Electronics & Automation

    Modern production facilities rely on robust, reliable control systems. Multi-layer PCBs offer high performance and resilience for industrial applications, IoT solutions, and automation technology.

Features

Discover the advanced capabilities Lexington can deliver.

Vias
Conductive pathways interconnecting PCB layers.
Blind/Buried
Concealed vias for cleaner surfaces and enhanced PCB designs.
Via Plugging
Filling or covering vias to enhance insulation and performance.
PCB Controlled Impedance
Innovative systems for precise impedance control in PCB manufacturing.
Surface Finish
High-quality surface treatments to enhance solderability and protect the board.
Heavy Copper
Thick copper layers for superior current handling and heat dissipation.

Frequently asked questions

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