Multilayer PCBs are circuit boards with four or more layers, separated by insulating dielectric layers and connected by conductive vias. This construction allows for higher circuit density, improved electromagnetic shielding, and reduced signal interference. They are used in demanding applications such as telecommunications, automotive, and medical technology, where reliable and compact electronic solutions are required. By combining multiple signal, power, and ground layers, multilayer PCBs provide high performance and design flexibility for modern electronic systems.
Feature | Specification |
---|---|
Layer | 4 to 40+ layers |
Board Thickness | 0.5 mm to 4.0 mm |
Copper Foil | 12–105 µm (standard: 18 or 35 µm) |
Treatment | ENIG, OSP, HASL, Immersion Silver/Tin |
Solder Mask | Green, Blue, Black, White |
Multi-layer PCBs enable compact and powerful medical devices like imaging systems, diagnostic equipment, and implants. They provide high signal integrity and reliability for precise measurements and controls.
In demanding environments like aerospace, multi-layer PCBs provide stability, high density, and reliable performance. They withstand extreme temperatures and vibrations, ensuring secure communication and navigation.
Vehicles with modern assistance systems, electric motors, and infotainment solutions require powerful electronics. Multi-layer PCBs enable compact designs and optimize signal processing for greater safety and efficiency.
Whether for high-speed data transmission or 5G technology, multi-layer PCBs ensure stable connections, minimize signal loss, and enable powerful network solutions with high bandwidth.
Modern production facilities rely on robust, reliable control systems. Multi-layer PCBs offer high performance and resilience for industrial applications, IoT solutions, and automation technology.
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